HTPC Case Design

This project is a medium form factor PC case designed to house ATX-standard components within a console-style layout. Unlike traditional tower cases, this design prioritizes compactness, thermal efficiency, and aesthetics, offering a sleek alternative for high-performance gaming and workstation setups. The challenge lies in optimizing airflow and component placement within a constrained form factor, ensuring both effective cooling and ease of assembly while maintaining compatibility with standard ATX hardware.

As a personal project, I am responsible for the entire product development process, from concept ideation and CAD modeling to thermal analysis and prototyping. Utilizing Autodesk Inventor, I have iterated through multiple design concepts to balance space efficiency, cooling performance, and manufacturability. I conducted preliminary CFD simulations to evaluate thermal performance, focusing on a positive pressure airflow model to ensure adequate cooling for both CPU and GPU components. Beyond engineering, I have also explored aesthetic design choices and material selection, refining the case for both functionality and visual appeal.

While my academic and extracurricular projects have taken priority, this personal endeavor continues to expand my engineering design and product development expertise beyond structured academic settings. With positive pressure cooling confirmed as a viable solution, the next phase involves manufacturing and assembling prototypes to test real-world performance, refine component tolerances, and validate the overall design before moving toward potential production.